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PCB PARAMETERS STANDARD TOP CAPABILITES
Layer count  32   50 
Line/Spacing Inner µm
mils		  100/100
4/4 		75/75
3/3
Outer µm
mils		 100/ 100 
4/5 		 75 /100
4/4
Min. finished hole diameter Mech mm
mils
 
 0.2
8
 
 0.15 
 6 
Laser mm
mils		 0.1
4 		0.1
4
Aspect ratio PTH 12 :1  13 :1 
Laser 0,8 1
Registration (pad difference) Inner µm
mils		 300
12 		300
12
Outer µm
mils		 250
10 		250
10
Solder mask registration µm
mils		 50
2		  50
2
Controlled impedance tolerance (%) 10 7
Buried holes Y Y
Blind holes - Depth drilling   Y  Y
Blind holes - Sequential lamination Y Y
Microvia laser One level on core with BVH One /Two  levels  on core with BVH
Max. Cu thickness   280 micron 
400 micron 
Panel size up to mm inch mm inch
1000
x
530		 39.3 x
20.8		 1300
x
600		 51.1
x
23.6
Board thickness mm 0.8  - 7.8 0.5  -  10 
inch 0.031-0.307 0.019 -0.393
Min. core
for inner		 mm 0.075 0.050
mils 3 2
 


Materials Roadmap
MATERIALS
Standard FR4
FR4 high TG and high CTI
Polyimide
Getek
Megtron V
Teflon
Rogers
Aramid
Kapton
Arlon
Taconic
Metal core
Halogen free
Surface Finishes
 
HASL and HASL lead free
Reflow Sn-Pb
OSP
Pd
Ni/Pd/Au
Immersion Ni/Au (ENIG)
Hard gold
Immersion tin
Oil surfusion
Carbon ink
 
 



Technology & Material Roadmap