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Special technologies

 

  • Blind & buried via's

  • High density interconnects (HDI)

  • Sequential lamination

  • Standard and large format backpanels

  • Impedence controlled

  • Mixed materials lamination

  • Thick copper

  • Rigid-Flex and Semiflex PCBs

  • Internal and external heat sinks

  • Heat sink paste 
   
   
CSI Division, special products

 

  • Flexible and rigid-flexible multilayers

  • Rigid-multiflex PCBs with mixed materials and different thickness of flex tails

  • Double-sided flexible circuits inclusive of  connector stiffener

  • Boards with flexible connections at different levels

  • Rigid and Rigid-flex PCBs with copper/invar/copper

  • Circuits with blind, buried and semi-buried holes

  • Rigid PCBs with polyimide, heavy copper and mixed materials 

 



Special Products & Technologies